BGA Testing for Reliable PCBs

Understanding Ball Grid Arrays (BGA)

A Ball Grid Array (BGA) is a type of surface mount packaging used for integrated circuits. It features an array of small solder balls (or "bumps") on the underside of the package, which connect the chip to the PCB (Printed Circuit Board). This allows for higher-density connections versus traditional leaded packages, making it ideal for complex and high-performance electronics.  

BGA Testing is crucial in the PCB assembly process to ensure connections are reliable and defect-free. Since BGA solder joints are hidden beneath the package, they can’t be visually inspected like other components. Specialized testing methods, such as X-ray inspection and Automated Optical Inspection (AOI), are used to detect issues like voids or misalignments. 

The Importance of BGA Testing

Why Choose Caltronics Design & Assembly for BGA Services?

  • Expertise: Our team has extensive experience in BGA testing, for precise and reliable results. 

  • Comprehensive Solutions: From testing to removal and reinstallation, we provide end-to-end BGA services for your PCB needs. 

Our BGA Testing  Services 

Our team offers BGA testing  services to ensure quality of your PCBs Our services include: 

  • X-Ray Inspection: We use advanced X-ray technology to inspect the integrity of BGA solder joints, identifying hidden defects. 

  • Automated Optical Inspection (AOI): AOI helps verify the correct placement and alignment of BGA components. 

Our team of skilled technicians is trained in the latest hand soldering techniques, ensuring each joint is perfectly formed.  

Markets We Serve

Get Started with BGA Testing

Trust the reliability and performance of your BGAs with Caltronics Design & Assembly. Contact us today to discuss your BGA testing needs.  

Get Started with Caltronics Today

Ready to turn your innovative ideas into reality? Fill out the form below or call us at 651.462.1440 to learn how we can assist you in achieving your goals.

Related Services